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| Tên thương hiệu: | HSTECH |
| Số mẫu: | SW-320YT |
| MOQ: | 1PC |
| giá bán: | negotiable |
| Điều khoản thanh toán: | T/T |
| Khả năng cung cấp: | 30000PCS |
Integrated Selective Wave Soldering Small Offline Wave Soldering Machine With Infrared Preheating 1KW
Features
Resolve flexible production of multiple varieties and small batches (flexible, convenient)
Quickly put on line for soldering, no fixture is required (available for direct soldering due to safe distance available)
Extremely low equipment purchase cost (low cost of initial investment)
Extremely low usage and maintenance costs (savings of tin slag, flux, electricity and consumables)
Tin penetration rate is 100% and the soldering yield is over 98%
Extremly low covering area(Approx. 1m2)
Specification
|
Specification item |
Integrated selective wave soldering SW-320YT |
|
Applicable PCB size |
L*W : 50×50～320×250 mm |
|
Applicable PCB thickness |
Substrate thickness:0.8～3 mm / Pin length:＜3mm |
|
Elements height |
Substrate top＜100mm / Substrate bottom ＜50mm |
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Substrate shape and conditions |
1. Substrate placement edge: The substrate process edge should be ≥3mm 2. The weight including electronic components is ＜5KG 3. Bending of substrate: ＜0.5mm |
|
Tin furnance |
Tin furnace material/capacity: all titanium alloy material/ 15KG Tin bath capacity:power:6*300W 1.8 KW |
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Preheating power |
Infrared preheating 1KW |
|
Total power |
AC 220V 3.5KW |
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N2 requirements |
Nitrogen purity:99.999% Pressure/Consumption:0.5MPa / 20ℓ/min～30ℓ/min / 1.2m3/H |
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Flux spray nozzle |
0.5mm precision fluid spray nozzle imported from Japan with original package |
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Flux capacity |
2 L |
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Air source |
0.5-0.7Mpa |
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Spray nozzle Inside Dia.. |
φ 3mm～φ 20mm Customizable size |
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Wave crest height |
Automatic alignment/height measurement |
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System control |
PC+PLC(windows+Siemens) |
|
Program software |
Support online or offline image programming |
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Video monitoring |
Real time video monitoring for easy viewing of soldering effects |
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Power Supply/Power |
Single phase 220V±10 Starting power:3.5KW |
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Weight |
120KG (including soldering tin 15KG) |
|
External dimensions |
L*W*H 750×950×1350 mm (including monitor) |
|
|
L*W*H 1000×980×1580 mm (including top cover) |
|
Specification item |
Integrated selective wave soldering SW-450YT |
|
Applicable PCB size |
L*W : 50×50～450×400 mm |
|
Applicable PCB thickness |
Substrate thickness:0.8～3 mm / Pin length:＜3mm |
|
Elements height |
Substrate top＜100mm / Substrate bottom ＜50mm |
|
Substrate shape and conditions |
1. Substrate placement edge: The substrate process edge should be ≥3mm 2. The weight including electronic components is ＜5KG 3. Bending of substrate: ＜0.5mm |
|
Tin furnance |
Tin furnace material/capacity: all titanium alloy material/ 15KG Tin bath capacity:power:6*300W 1.8 KW |
|
Preheating power |
Infrared preheating 1KW |
|
Total power |
AC 220V 3.5KW |
|
N2 requirements |
Nitrogen purity:99.999% Pressure/Consumption:0.5MPa / 20ℓ/min～30ℓ/min / 1.2m3/H |
|
Flux spray nozzle |
0.5mm precision fluid spray nozzle imported from Japan with original package |
|
Flux capacity |
2 L |
|
Air source |
0.5-0.7Mpa |
|
Spray nozzle Inside Dia |
φ 3mm～φ 20mm Customizable size |
|
Wave crest height |
Automatic alignment/automatic height measurement |
|
System control |
PC+PLC(windows+Siemens ) |
|
Program software |
Support programming for drawing lines in images(convenient & fast) |
|
Video monitoring |
Real time video monitoring for easy viewing of soldering effects |
|
Power Supply/Power |
Single phase 220V±10% Starting power:3.5KW |
|
Weight |
150KG (Including soldering tin 15KG) |
|
|
L*W*H 880×1280×1350 mm (Including monitor) |
|
External dimensions |
L*W*H 1270×1280×1580 mm (Excluding tri-colored lights) |
Preheating of PCB board top
Preheating of PCB board top(Optional) 1KW infrared heating tube is used to preheat the PCB board top before soldering, which meets the high temperature requirements of special elements, reduces the thermal shock of elements, activates the activity of flux, improves the tin penetration of component pins and improves the soldering quality.
Preheating of PCB board bottom
Preheating of PCB board bottom Taking advantage of fast infrared heat conduction, the PCB board is preheated before soldering, and kept being heated at a set frequency during soldering to prevent the PCB board from dropping temperature during soldering. It belongs to the design principle of synchronized"preheating+ soldering ", which improves the soldering efficiency and the tin penetration rate of elements, and reduces the thermal shock caused by the sudden heat of heat-sensitive elements, and the cleanliness of PCB after soldering is relatively high.
Consumables – Spray nozzles
The nozzle can be selected according to the size of the solder joint. Can control the solder penetration rate and soldering time of each solder point.
Machine part photos
